AnnexⅢ,5(b)

Lead in glass of fluorescent tubes not exceeding 0.2% by weight

Lead (not intentionally added) in soda lime glass used in the glass tube of fluorescent lamps, not exceeding 0.2% by weight

21 July 2026 for category 5

AnnexⅢ,18(b)

Lead as activator in the fluorescent powder(1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP

Lead as activator in the fluorescent powder(1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP(BaSi205:Pb)

21 July 2026 for categories 5,8 and 9;
21 July 2023 for category 8 in vitro diagnostic medical devices;

21 July 2024 for category 9 industrial monitoring and control instruments, and for category 11

AnnexⅢ,18(b)-Ⅰ

Lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps containing phosphors such as BSP when used in medical phototherapy equipment

It is recommended to group exemption 18(b)-ⅠAnnex Ⅲ and exemption 34 Annex Ⅳ under a new item(18(b)-Ⅱ) in Annex Ⅲ. The proposed wording for the new item has no implications on the scope of existing exemptions 18(b)-Ⅰ and Ex.34

New item:18(b)-Ⅱ
Lead as activator in the fluorescent powder(1% lead by weight or less) of discharge lamps  containing phosphors such as BSP(BaSi205:Pb) when used in medical phototherapy equipment, incl. extracorporeal photopheresis lamps

For the new item 18(b)-Ⅱ 
21 July 2026 for categories 5,8 and 9

Annex Ⅳ 34

Lead as activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi205:Pb) phosphors

Annex Ⅲ 24

Lead in solders for the soldering to machine through hole discoidal and planar array ceramic multilayer capacitors.

Lead in solders for the soldering to machine through hole discoidal and planar array ceramic multilayer capacitors

18-month transition period

New item:24(a):
Lead in alloys used for soldering to through hole discoidal and/or planar array ceramic multilayer capacitors
Ⅰ) Not exceeding 50% by weight for applications where the components are mechanically mounted(e.g. by bolts, clips or screws) or bonded by a selective soldering/welding process and where the component will not exceed a temperature of 150℃
Ⅱ) In high melting point solders containing≥85% lead by weight for cases where the components are mounted using an elevated temperature process(e.g. solder reflow, welding) at a temperature of≥150℃ or where the component is rated to operate at a temperature of≥150℃ 

21 July 2026 for categories 1-11

Annex Ⅲ 29

Lead bound in crystal glass as defined in AnnexⅠ(Categories 1,2,3 and 4) of Council Directive 69/494/EEC

Lead bound in crystal glass as defined in AnnexⅠ(Categories 1,2,3 and 4) of Council Directive 69/494/EEC

21 July 2026 for categories3,4,5 and 11;
21 July 2023 for category8 in-vitro diagnostic medical devices;
21 July 2024 for category 9 industrial monitoring and control instruments

Annex Ⅲ 32

Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes

Lead oxide in glass frit used as a sealing material for making window assemblies for argon and/or Krypton laser tubes

21 July 2024 for category 11;
21 July 2026 for categories6,8 and 9

Annex Ⅲ 34

Lead in cermet-based trimmer potentiometer elements

Lead in cermet-based trimmer potentiometer elements

21 July 2024 for all categories